Let's example
assume an :
avoids
This disturbing other
· cells .
(Floating-gate MOS)
The Tunnel-Oxide because
from
type
second which
· differs
FLOTOX
is FAMOS :
the floating drain
the
extends
gate over .
layer
thin
by
separated
it oxide
is very .
a
This avalanche Let's
tunnelling
· enables quantum instead of
of insection Flotox in
see case :
.
,
(tunnel effect)
Programming
1. Vo = Upp
Vs
.
ii = 0 from
the channel
tunnel through oxide
electrons thin gate
the floating
the
into
iii .
.
Because oxide
the thinner needed
lower
is is
energy .
,
(
(tunnel
Erasing effect again
Vo =
1. ·
Upp
Ve =
ii. tunnel from the back
floating
electrons drain
the
to
gate
.
iii .
So unlike electrical
EPROM
UV is
easing
, .
,
EEPROM
· is :
based transistors
FLOTOX
on . fuse
ideally PROM with instead of
FLOTOX MOSI
a .
,
He defining
· feature : hence
electrical the Erasable
Electrically PROM
erasing is .
name
, chip
whole
selected not the
only erased
cells are
Let's the architecture
· of
ideal erasing
in programming
see case and :
Vpp 3
=
영 i ↑ ↑
erasing crasing
ㅇ programming
programming
"
To both
· solve and disturbi
write crase
two
each transistors
cell uses :
memory
1 FLOTOX
.
i trancistor
1n-MOS
ii. pass .
. which
selects
Seli signal
The This
exactly connected.
cell
· is :
selected erased
programmed
Only the cell is or .
other electrically .
All cells isolated
are 、
In architecture following table
real to the
according :
,
a gnos
Seli Bly
WLi ,
,
, ,
> to li.
other
all
refer
.
nes
Operations :
Program ) connected")
others
selectively impedance
High
apply Vpp
Vec "not
z
in meaning
: ,
, . .
Erase appropriately
voltages
swap
:
Read standard output
low-voltage operation Q.
: ,
110 Lecture the latest technologies
Flash represents evolution of ROM
Memory .
In flash CFGMOS)
floating
implemented
each gate
· with transistor
cell MOS
is
memory
memory a ,
, simple
the transistore
transistor Whereas rely
earlier
Flash
specifically ROMs either MOS
on
,
anti-fuses
fuses
on
or .
technological
From point Flash of
· evolution EEPROM
of is
view :
memory an
a ,
the principle the floating gate
with
transistor
MOS
is same : a .
electrical Without light
erasing fully UV
programming are
and , .
Flash introduces which
but cost
density
important and bit,
advantages speed
mainly in ma
per
,
, , ,
storage
for
suitable
it
Ke massive .
The flash
application such
· non-volatile drives and
of storage USB
main is massive as
memory ,
Like be
SSDs but classical and
retains it
unlike written
without
data
ROM it ROM can
power
. ,
a , through
multiple times
rewritten operations
+
erase program .
However Flash CRWM)
Read
cannot considered because physical
be
· waiting
true Waite Memory is
a ,
, the
ly and
oxide should
Ideally
the device
disruptive damages support
slowly RWM
it stresses
: an
,
. cycles
limited
whereas
cycles has
Flash still
the number
write endurance of
infinite if is
even
, ,
high .
very
The characteristics
the
Flash
· Transistor another by and
of
obtained
FGMOS FLO
FAMOS
is merging
, .
TOX . ·
two
Comparing Flash features
· defining
and
FAMOS FLOTOX see
can
we :
, ,
Symmetric floating where the floating closer the
to
gate drain
unlike
gate
.
1 FAMOS is
: ,
,
positioned This
symmetrically between drain
floating gate
Flash the im
is
in source and .
and reliability
uniformity
proves . oxida
compared the
floating
thin between
Very and under
oxide
.
2 to
substrate
gate FAMOS
: ,
the his
tunnelling
much allowing
floating thimer the when
electron oxide
through
gate is ,
gh fields applied
are .
This tunnel
structural both
Flash for and
· allows to effect
compromise erasi
programming
use τ
while
like assisted
drain
but also exploiting to
similar
FLOTOX FAMOS
programming
ng - , .
, ,
Both with bias
tunnelling but
quantum conditions
operations rely
· different :
on , gatel
Programming (election floating
into
insection
exactly like
Vo Vo Upp FAMOS
= = .
,
VsuB O
= (not
floating
left connected
the
Vs Z is
meaning
= source
, here becau
don't
electrons sump
the insulation
~ thicker
se is
electrons
these
With
· voltages tunnel the
drain and
sufficient the into
gain near
energy
,
floating threshold
the
gate voltage
increasing
, .
/electron .
Erasing from
removal floating gate)
Va = 0 Vpp
VsuB =
Vs Vs z
= = electric field
Now
· the the
from back
floating substrate
elections throu
the
gate
pulls into
thin lowering
the
gh the threshold
oxide voltage .
, (WL)
Flash how and lines
bit
to
connected
differ lines
word
· transistors
mainly in
memory are
The two
(BL) categories are :
.
This Flash while
Why
explains
· and
drives Flash embedded
used
NOR
NAND
SSDs
USB in
is by
use ,
Let's look
stems firmware take to architecture
for Flash
NAND
a
. the
In
= architecture each
NAND of
column string
is
, a
Flash connected
transistors in series :
lines
Who Word
WLp :
, ..., .
Blo bit
BLm lines
:
, ..., .
Line)
(String Select transis
drives the top
SSL : pass
(n-MOS)
tor .
/Ground Line) bottom
Select the
GSL drives
: pass
(n-MOS)
transistor .
A typically
string transistors
contains cells
all the
to
· corresponds to connected to
198
32 came
page
a
, which for
block crucial
includes
and substrate
and the
shares
WL is enase
same
pages opera
many
a ,
tions .
Like
· need to
FGMOS
any we :
,
Choose V
such that
Up VR
V programmed)
I
If erased
the transistor
not the circuit
turns
cell short
. ON
is
i I .
,
the
If cell programmed transistor
the .
remains
is
ii circuit
Off
. s open
,
Additionally bypass
· exists
voltage Vpp :
, a forcing transistor
the always
V
Vsp ON
> ,
This bypass
essential unselected
to cells
is
during read program .
Flash
NAND With
· operates :
by
Read page .
by
Program .
page
by
Erase page . example
Let's for
This fundamental behavior
and
asymmetry
· explains performance
is assume an
.
each operation :
Program by
.
1 page Biasing
E : bottom selector
GSL V
0 OFF
= = .
top
Vcc selector
SSL .
" ON
=
Upp to all other
Upp
cells
WL of program
on on
,
WLs of
Upp other
cells to
BL BLs
OV
program
on on .
,
In the diagram electrically
the enabled string
· the
because keeps
condition GSL iso
programming is
, So
lated by
, unintended multiple
preventing conduction cells
program means program
can
page you
,
.
different
the not
but
in in
same page .
pages
,
E by
Erase page
. Biasing
=> : V disconnected
OV
GSL strings
SSL all
O :
=
= ,
all
OV WLs .
on
Upp substrate
the
on .
Because block
block the
the substrate the
all
· erased
cells entire
share simultaneously
is
in ,
block
This the
Why granularity
is is
erase .
Read by
3
3 page Biasing
=> : Vec
6S Vec SSL =
= , to
the
Vp of .
WL
on page read
other
all
VBp WLs .
on
Vac all BLs .
on
a
two
Let's analyze
· cases : 0
10
reading cell
Case 1 ,
: 0)
(0 11 1)
and
Cells programmed
are
, .
,
The 0)
10
diagram because
highlights that programmed s transistor
down
pulled
Blo is
is ,
logic
conduction path .
'I'
OFF > :
no 0
(1
reading
Case cell
2 : , .
0) (not
(1
Cell crased programmed)
is
,
Blo
Now through pathologic
discharges the conducting o
Data
A Flash before
impossible
· blocks not just
contains overwriting is Writ
memory many one :
.
,
ting block
whole
the .
data be
must erased
new ,
each
For write : block
entire
the
erase . by
block
the time
at
WL
one
program page page a .
,
In terms flexibility
· of and
cost : be
cannot
transistor manufacturing
.
1 cells
not modified
ROM all after
in .
: ,
transistor fuse entire
PROM cell
.
2 + one memory
: one crase
EPROM
3
3 transistor by
cell cell entire
one crase
program
per
: memory
, .
,
4
. transistor by
transistors
Flash cell by
strings cell block
one per crase
pass on
: program
+ .
, ,
I
two transistores highest
by
5 highest
call
EEPROM and cell flexibility
: erase
per co
program
. ,
,
)
st .
This explains speed
density flexibility
between
Flash's position and
compromise
unique : a , ,
o Lecture
1 Memory)
/Random
With term to
that
to direct
refer
the
· RAM allow
Access memories
we access
the
With physical ty.
independently of RAM
location time position
its is
same access ,
any memory .
fundamental
characterized two properties
by
pically .
First IRWM) both
be
that
Read
RAM retrie
stored and
data
and Memory
Write meaning
is can
a ,
, which
red volatile that when
during removed
Second
freely RAM the
operation is
is power
means
. , ,
,
stored lost
information is .
It important clarify frequent Flash
· and
to EPROM
confusion EEPROM
of
is memories
source :
a , , devices
they
similar because
could those
rewriting
to allow writing
However
RWM in
.
appear , ,
by
followed which
to
corresponds operation
disruptive redu
and
is
reprogramming
erase , a
an degrade the
lifetime
the device structure
not
does
it
meaning .
ces memory
,
From classification perspective divided into
· RAM is :
a ,
:
(SRAM) the
Static long
RAM without
maintained
content supplied
is
is
memory power
as
as ,
refresh operations
requiring .
:
(DRAM)
Dynamic powered
when
RAM periodically
stored must refue
be
the information
even ,
shed charge leakage
last to
otherwise due
it is .
,
This distinction focusing
for the
which subject
· rest the
specifically
stage the of
the
sets SRAM of
is
on ,
discussion. bistable
The fundamental block which
building of circuit
the cell
SRAM is
· is memory a .
,
bistable two-closed feeds
A realized where inverter
loop each
system
· inverters
is using ,
other feedback
the loop
the
input creating
of positive
a .
,
Because has
the
structure cell two stable
this only states
and
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Appunti Electronics systems (parte 1)
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Appunti Electronics systems (parte 2)
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Appunti Electronics systems (parte 5)
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Appunti Electronics systems (parte 3)
- Risolvere un problema di matematica
- Riassumere un testo
- Tradurre una frase
- E molto altro ancora...
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